ZSC31010CED
制造商:IDT, Integrated Device Technology Inc
封装外壳:-
描述:DICE (WAFER SAWN) - WAFFLE PACK
1506
现货
斯普仑电子元件现货为您提供IDT, Integrated Device Technology Inc设计生产的ZSC31010CED,现有足量库存。ZSC31010CED的封装/规格参数为:-;同时斯普仑现货为您提供ZSC31010CED数据手册/使用说明书等中文资料,资料中有ZSC31010CED的详细使用方法及教程。